LM3S5762_14 Datasheet, PDF (844/851 Pages) Texas Instruments – Microcontroller

Package Information
Note: The following notes apply to the package drawing.
1. All dimensions shown in mm.
2. Dimensions shown are nominal with tolerances indicated.
3. Foot length 'L' is measured at gage plane 0.25 mm above seating plane.
4. L/F: Eftec 64T Cu or equivalent, 0.127mm (0.005") thick.
Symbols
A
A₁
A₂
D
D₁
E
E₁
L
e
b
θ
ddd
ccc
Body +2.00 mm Footprint, 1.4 mm package thickness
Leads
Max.
-
±0.05
±0.20
±0.10
±0.20
±0.10
+0.15/-0.10
Basic
±0.05
-
Max.
Max.
JEDEC Reference Drawing
Variation Designator
64L
1.60
0.05 Min./0.15 Max.
1.40
12.00
10.00
12.00
10.00
0.60
0.50
0.22
0˚-7˚
0.08
0.08
MS-026
BCD
844
July 17, 2014
Texas Instruments-Production Data