OPA354_16 Datasheet, PDF (7/44 Pages) Texas Instruments – 250-MHz, Rail-to-Rail I/O, CMOS Operational Amplifiers

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OPA354, OPA2354, OPA4354
SBOS233F – MARCH 2002 – REVISED JUNE 2016
7.4 Thermal Information: OPA354
THERMAL METRIC⁽¹⁾
OPA354
DBV (SOT-23)
DDA (HSOP)
UNIT
5 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
216.3
84.3
43.1
3.8
42.3
—
42.5
°C/W
54
°C/W
26.5
°C/W
8
°C/W
26.4
°C/W
3.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information: OPA2354
THERMAL METRIC⁽¹⁾
OPA2354
DDA (HSOP)
DGK (VSSOP)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
40.6
175.9
°C/W
46
67.8
°C/W
20.7
97.1
°C/W
5.6
9.3
°C/W
20.6
95.5
°C/W
2.5
—
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Thermal Information: OPA4354
THERMAL METRIC⁽¹⁾
OPA4354
D (SOIC)
PW (TSSOP)
UNIT
14 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
83.8
92.6
°C/W
70.7
27.5
°C/W
59.5
33.6
°C/W
11.6
1.9
°C/W
37.7
33.1
°C/W
—
—
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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