OPA354_16 Datasheet, PDF (2/44 Pages) Texas Instruments – 250-MHz, Rail-to-Rail I/O, CMOS Operational Amplifiers

OPA354, OPA2354, OPA4354
SBOS233F – MARCH 2002 – REVISED JUNE 2016
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information: OPA354 .................................. 7
7.5 Thermal Information: OPA2354 ................................ 7
7.6 Thermal Information: OPA4354 ................................ 7
7.7 Electrical Characteristics: V_S = 2.7 V to 5.5 V Single-
Supply ........................................................................ 8
7.8 Typical Characteristics ............................................ 10
8 Detailed Description ............................................ 15
8.1 Overview ................................................................. 15
8.2 Functional Block Diagram ....................................... 15
8.3 Feature Description................................................. 16
8.4 Device Functional Modes........................................ 20
9 Application and Implementation ........................ 21
9.1 Application Information............................................ 21
9.2 Typical Application ................................................. 21
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 23
11.1 Layout Guidelines ................................................. 23
11.2 Layout Example .................................................... 23
11.3 Power Dissipation ................................................. 23
11.4 PowerPAD Thermally-Enhanced Package ........... 24
11.5 PowerPAD Assembly Process .............................. 24
12 Device and Documentation Support ................. 26
12.1 Documentation Support ....................................... 26
12.2 Related Links ........................................................ 26
12.3 Receiving Notification of Documentation Updates 26
12.4 Community Resources.......................................... 26
12.5 Trademarks ........................................................... 26
12.6 Electrostatic Discharge Caution ............................ 26
12.7 Glossary ................................................................ 27
13 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
Changes from Revision E (March 2002) to Revision F
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Deleted Package/Ordering Information table, see POA at the end of the data sheet............................................................ 1
• Renamed OPAx354 Related Products table to Device Comparison Table ........................................................................... 3
2
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