OPA316-Q1 Datasheet, PDF (7/39 Pages) Texas Instruments – 10-MHz, Rail-to-Rail Input/Output, Low-Voltage, 1.8-V CMOS Operational Amplifier

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OPA316-Q1, OPA2316-Q1, OPA4316-Q1
SBOS841A – NOVEMBER 2016 – REVISED JANUARY 2017
6.4 Thermal Information: OPA316-Q1
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case(top) thermal resistance⁽³⁾
Junction-to-board thermal resistance⁽⁴⁾
Junction-to-top characterization parameter⁽⁵⁾
Junction-to-board characterization parameter⁽⁶⁾
Junction-to-case(bottom) thermal resistance⁽⁷⁾
OPA316-Q1
DBV (SOT-23)
5 PINS
221.7
144.7
49.7
26.1
49
N/A
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining R_θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining R_θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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