OPA316-Q1 Datasheet, PDF (2/39 Pages) Texas Instruments – 10-MHz, Rail-to-Rail Input/Output, Low-Voltage, 1.8-V CMOS Operational Amplifier

OPA316-Q1, OPA2316-Q1, OPA4316-Q1
SBOS841A – NOVEMBER 2016 – REVISED JANUARY 2017
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Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 ESD Ratings ............................................................ 6
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information: OPA316-Q1 ............................ 7
6.5 Thermal Information: OPA2316-Q1 .......................... 8
6.6 Thermal Information: OPA4316-Q1 .......................... 9
6.7 Electrical Characteristics......................................... 10
6.8 Typical Characteristics ............................................ 12
7 Detailed Description ............................................ 18
7.1 Overview ................................................................. 18
7.2 Functional Block Diagram ....................................... 18
7.3 Feature Description................................................. 18
7.4 Device Functional Modes........................................ 20
8 Application and Implementation ........................ 21
8.1 Application Information............................................ 21
8.2 Typical Application .................................................. 22
9 Power Supply Recommendations...................... 25
10 Layout................................................................... 26
10.1 Layout Guidelines ................................................. 26
10.2 Layout Example .................................................... 26
11 Device and Documentation Support ................. 27
11.1 Documentation Support ........................................ 27
11.2 Related Links ........................................................ 27
11.3 Receiving Notification of Documentation Updates 27
11.4 Community Resources.......................................... 27
11.5 Trademarks ........................................................... 27
11.6 Electrostatic Discharge Caution ............................ 27
11.7 Glossary ................................................................ 27
12 Mechanical, Packaging, and Orderable
Information ........................................................... 28
4 Revision History
Changes from Original (November 2016) to Revision A
Page
• Changed CDM classification reduced from C6 ..................................................................................................................... 1
• Deleted OPA2316S-Q1 package and body size information from Device Information table ................................................ 1
• Deleted SC70 (5) (OPA316-Q1), DFN (8), MSOP (8), SOIC (8) (OPA2316-Q1), and SOIC (14) packages
(OPA4316-Q1) from the Device Information table, Thermal Information tables, and pinout diagrams.................................. 1
• Deleted OPA2316S-Q1 pin diagram and Pin Functions table in Pin Configurations and Functions section ........................ 3
• Deleted D (SOIC) package from OPA4316-Q1 pin diagram in Pin Configurations and Functions section .......................... 5
• Changed CDM rating from ±1500 V to ±750 V ...................................................................................................................... 6
• Deleted OPA2316S-Q1 device thermal information in the Thermal Information table .......................................................... 7
• Added thermal information for OPA4316-Q1 device .............................................................................................................. 9
• Deleted the literature numbers in parentheses from the format of TI document references in the Documentation
Support section .................................................................................................................................................................... 27
2
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