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HD3SS215 Datasheet, PDF (7/32 Pages) Texas Instruments – 6.0 Gbps HDMI DisplayPort 2:1/1:2 Differential Switch
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HD3SS215, HD3SS215I
SLAS971D – MAY 2014 – REVISED OCTOBER 2015
7 Specifications
7.1 Absolute Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted)
Supply voltage VDD
Differential I/O
Voltage
AUX_SEL, Dx_SEL
HPDx, DDCCLK_X, DDCDAT_X
Tstg
Storage temperature
VALUE
MIN
MAX
–0.5
4
–0.5
4
–0.5
4
–0.5
6
–65
150
UNIT
V
V
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground pin.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
VALUE
±1500
±1250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VDD
Main power supply
TA
Operating free-air temperature
CAC
AC coupling capacitor
HD3SS215
HD3SS215I
MIN
NOM
MAX
3
3.3
3.6
0
70
–40
85
75
100
200
UNIT
V
V
UNIT
V
°C
°C
nF
7.4 Thermal Information
THERMAL METRIC(1)
HD3SS215
RTQ (56 PIN) ZQE (50 PIN)
UNIT
RθJA
RθJC(top)
RθJB
ψJT
ψJB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
90.5
71.6
°C/W
41.9
44.1
°C/W
53.9
49.0
°C/W
1.8
2.7
°C/W
53.4
49.0
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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