HD3SS215 Datasheet, PDF (23/32 Pages) Texas Instruments – 6.0 Gbps HDMI DisplayPort 2:1/1:2 Differential Switch

PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2015
PACKAGING INFORMATION
Orderable Device
HD3SS215IRTQR
HD3SS215IRTQT
HD3SS215IZQER
HD3SS215IZQET
HD3SS215RTQR
HD3SS215RTQT
HD3SS215ZQER
HD3SS215ZQET
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
QFN
RTQ 56 2000 Green (RoHS
& no Sb/Br)
ACTIVE
QFN
RTQ 56 250 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
50 2500 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
ZQE 50 250 Green (RoHS
MICROSTAR
& no Sb/Br)
JUNIOR
ACTIVE
QFN
RTQ 56 2000 Green (RoHS
& no Sb/Br)
ACTIVE
QFN
RTQ 56 250 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
50 2500 Green (RoHS
& no Sb/Br)
PREVIEW
BGA
ZQE 50 250
MICROSTAR
JUNIOR
TBD
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
SNAGCU
SNAGCU
CU NIPDAU
CU NIPDAU
SNAGCU
Call TI
MSL Peak Temp Op Temp (°C)
(3)
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR -40 to 85
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
0 to 70
0 to 70
0 to 70
Call TI
0 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
HD3SS215I
HD3SS215I
HD3SS215I
HD3SS215I
HD3SS215
HD3SS215
HD3SS215
HD3SS215
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples