DS90C032QML Datasheet, PDF (7/18 Pages) Texas Instruments – DS90C032QML LVDS Quad CMOS Differential Line Receiver

Symbol
Parameter
t_PZH
Enable Time Z to High
t_PZL
Enable Time Z to Low
Conditions
Input pulse = 0V to 3.0V,
V_I = 1.5V, V_O = 50%,
R_L = 1KΩ to Gnd
Input pulse = 0V to 3.0V,
V_I = 1.5V, V_O = 50%,
R_L = 1KΩ to V_CC
Notes
Min Max
20
Units
ns
Sub-
groups
9, 10, 11
20
ns
9, 10, 11
AC/DC Post Radiation Limits (Note 7)
Symbol
Parameter
I_CC
No Load Supply Current
I_CCZ
No Load Supply Current
Receivers Disabled
Conditions
EN, EN* = V_CC or Gnd,
Inputs Open
EN, EN* = 2.4 or 0.5,
Inputs Open
EN = Gnd, EN* = V_CC,
Inputs Open
Notes
Min Max
20
Units
mA
20
mA
20
mA
Sub-
groups
1
1
1
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: Derate LCC @ 12.2mW/°C above +25°C. Derate ceramic flatpack @ 6.8mW/°C above +25°C
Note 3: Human body model, 1.5 kΩ in series with 100 pF.
Note 4: Tested during V_OH / V_OL tests.
Note 5: Channel-to-Channel Skew is defined as the difference between the propagation delay of one channel and that of the others on the same chip with an
event on the inputs.
Note 6: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Note 7: Pre and post irradiation limits are identical to those listed under AC & DC electrical characteristics except as listed in the “Post Radiation Limits” table.
Radiation end point limits for the noted parameters are guaranteed only for the conditions, as specified.
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