CC2591_17 Datasheet, PDF (7/25 Pages) Texas Instruments – 2.4-GHz RF Front End

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CC2591
SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014
Electrical Characteristics (continued)
T_C = 25°C, V_DD = 3 V , f_RF= 2440 MHz (unless otherwise noted). Measured on CC2591EM reference design including external
matching components.
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
Gain variation, -40°C – 85°C, High-Gain
Mode
HGM = 1
3
dB
Noise figure, High-Gain Mode
HGM = 1, including internal T/R switch and external
antenna match
4.8
dB
Input 1-dB compression, High-Gain Mode HGM = 1
–17
dBm
Input IP3, High-Gain Mode
HGM = 1
–2
dBm
Input reflection coefficient, S11
HGM = 1, measured at antenna port
–11
dB
RF Transmit
Gain
22
dB
Output power, P_OUT
Maximum output power
Power Added Efficiency, PAE
Output 1-dB compression
P_IN = 0.5 dBm
P_IN = 5 dBm
P_IN = 0.5 dBm
20.6
22
34%
19
dBm
dBm
dBm
Output IP3
32
dBm
Output power variation over frequency
Output power variation over power supply
Output power variation over temperature
Second harmonic power
2400 – 2483.5 MHz, P_IN = 0.5 dBm
2 V – 3.6 V , P_IN = 0.5 dBm
-40°C – 85°C, P_IN = 0.5 dBm
P_IN = 0.5 dBm. The second harmonic can be reduced
to below regulatory limits by using an external LC filter
and antenna.
0.5
dB
3.5
dB
1.5
dB
–15
dBm
Third harmonic power
P_IN = 0.5 dBm. The third harmonic can be reduced to
below regulatory limits by using an external LC filter
and antenna.
–30
dBm
4.5 Thermal Resistance Characteristics for RGV Package
NAME
DESCRIPTION
°C/W ^{(1) (2)}
AIR FLOW (m/s)⁽³⁾
RΘ_JC-top
RΘ_JB
RΘ_JA
Psi_JT
Psi_JB
RΘ_JC-bottom
Junction-to-case (top)
Junction-to-board
Junction-to-free air
Junction-to-package top
Junction-to-board
Junction-to-case (bottom)
52.8
0.00
20.4
0.00
41.9
0.00
1.4
0.00
20.5
0.00
8.3
0.00
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) m/s = meters per second.
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