CC2591_17 Datasheet, PDF (18/25 Pages) Texas Instruments – 2.4-GHz RF Front End

PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device
CC2591RGVR
CC2591RGVRG4
CC2591RGVT
CC2591RGVTG4
HPA00420RGVR
HPA01083RGVR
HPA02142RGVR
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
VQFN
RGV 16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGV 16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGV 16
250 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGV 16
250 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGV 16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGV 16 2500 Green (RoHS
& no Sb/Br)
ACTIVE
VQFN
RGV 16 2500 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp Op Temp (°C)
(3)
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
CC2591
CC2591
CC2591
CC2591
CC2591
CC2591
CC2591
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
Samples
Addendum-Page 1