TLE208X_16 Datasheet, PDF (6/79 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001
TLE2084Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2084. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(2)
(1)
(14)
(13)
(3)
(12)
150 (4)
(11)
(3)
1IN +
VCC+
(4)
+
(2)
1IN –
–
(7)
+
2OUT
(10)
–
3IN +
+
(9)
3IN –
–
(14)
+
4OUT
–
(11)
VCC _–
(1)
1OUT
(5)
2IN +
(6)
2IN –
(8)
3OUT
(12)
4IN +
(13)
4IN –
(5)
(6)
(7)
100
(10)
(8)
(9)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
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