TLE208X_16 Datasheet, PDF (2/79 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001
TLE2081 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
PLASTIC
DIP
(D)
(FK)
(JG)
(P)
0°C to 70°C
3 mV
6 mV
TLE2081ACD
TLE2081CD
—
—
TLE2081ACP
TLE2081CP
–40°C to 85°C
3 mV
6 mV
TLE2081AID
TLE2081ID
—
—
TLE2081AIP
TLE2081IP
– 55°C to 125°C
3 mV
6 mV
TLE2081AMFK TLE2081AMJG
—
TLE2081MFK TLE2081MJG
—
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2081ACDR).}
‡ _{Chip forms are tested at TA = 25°C only.}
CHIP
FORM
(Y)
—
TLE2081Y
—
—
TLE2082 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
PLASTIC
DIP
(D)
(FK)
(JG)
(P)
0°C to 70°C
4 mV
7 mV
TLE2082ACD
TLE2082CD
—
—
TLE2082ACP
TLE2082CP
– 40°C to 85°C
4 mV
7 mV
TLE2082AID
TLE2082ID
—
—
TLE2082AIP
TLE2082IP
– 55°C to 125°C
4 mV
7 mV
TLE2082AMD TLE2082AMFK TLE2082AMJG TLE2082AMP
TLE2082MD
TLE2082MFK TLE2082MJG TLE2082MP
‡ _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2082ACDR).}
‡ _{Chip forms are tested at TA = 25°C only.}
CHIP FORM
(Y)
—
TLE2082Y
—
TLE2084 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
PLASTIC
DIP
(DW)
(FK)
(J)
(N)
0°C to 70°C
4 mV
7 mV
TLE2084ACDW
TLE2084CDW
—
—
TLE2084ACN
TLE2084CN
– 55°C to 125°C
4 mV
7 mV
TLE2084AMFK TLE2084AMJ
—
TLE2084MFK TLE2084MJ
—
† _{The DW packages are available taped and reeled. Add R suffix to device type (e.g., TLE2084ACDWR).}
‡ _{Chip forms are tested at TA = 25°C only.}
CHIP
FORM
(Y)
—
TLE2084Y
—
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