TLE208X_16 Datasheet, PDF (4/79 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182B – FEBRUARY 1997 – REVISED JUNE 2001
TLE2081Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2081. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(2)
(8)
(1)
OFFSET N1
VCC+
IN + ⁽³⁾ ₊
(7)
(6)
(2)
OUT
IN –
–
(5)
OFFSET N2
(4)
VCC _–
85
(7)
(3)
(4) (5)
58
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(6)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
4
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