OPA191_017 Datasheet, PDF (6/51 Pages) Texas Instruments – 36-V, Low Power, Precision, CMOS, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Op Amp

OPA191, OPA2191, OPA4191
SBOS701A – DECEMEBER 2015 – REVISED APRIL 2016
www.ti.com
6.5 Thermal Information: OPA2191
THERMAL METRIC⁽¹⁾
OPA2191
8 PINS
UNIT
D (SOIC)
DGK (VSSOP)
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
107.9
53.9
48.9
6.6
48.3
N/A
158
°C/W
48.6
°C/W
78.7
°C/W
3.9
°C/W
77.3
°C/W
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.6 Thermal Information: OPA4191
THERMAL METRIC⁽¹⁾
OPA4191
14 PINS
UNIT
D (SOIC)
PW (TSSOP)
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
86.4
92.6
°C/W
46.3
27.5
°C/W
41.0
33.6
°C/W
11.3
1.9
°C/W
40.7
33.1
°C/W
N/A
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: OPA191 OPA2191 OPA4191