OPA191_017 Datasheet, PDF (5/51 Pages) Texas Instruments – 36-V, Low Power, Precision, CMOS, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Op Amp

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OPA191, OPA2191, OPA4191
SBOS701A – DECEMEBER 2015 – REVISED APRIL 2016
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V_S = (V+) – (V–)
Signal input pins
Output short circuit⁽²⁾
Temperature
Voltage
Current
Operating
Junction
Storage, T_stg
Dual supply
Single supply
Common-mode
Differential
MIN
MAX
±20
40
(V–) – 0.5
(V+) + 0.5
(V+) – (V–) + 0.2
±10
Continuous
–40
150
150
–65
150
UNIT
V
V
mA
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±3000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage, V_S = (V+) – (V–)
Operating temperature
Dual supply
Single supply
MIN
±2.25
4.5
–40
NOM
MAX
±18
36
125
UNIT
V
°C
6.4 Thermal Information: OPA191
THERMAL METRIC⁽¹⁾
OPA191
8 PINS
5 PINS
UNIT
D (SOIC) DGK (VSSOP) DBV (SOT)
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
115.8
60.1
56.4
12.8
55.9
N/A
180.4
67.9
102.1
10.4
100.3
N/A
158.8
60.7
44.8
1.6
4.2
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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