HD3SS460_17 Datasheet, PDF (6/37 Pages) Texas Instruments – 4 x 6 Channels USB Type-C Alternate Mode MUX

HD3SS460
SLLSEM7D – JANUARY 2015 – REVISED JANUARY 2017
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Supply Voltage, VCC
Differential High Speed I/O Voltages, C[R/T]X[1/2][p/n], Ln[A-D][p/n], SS[R/T]X[p/n]
Low Speed I/O Voltages, CSBU[1/2], SBU[1/2]
Control signal voltages, POL, AMSEL, EN
Storage temperature, T_stg
MIN
MAX
UNIT
–0.5
4
V
–0.5
2.5
V
–0.5
4
V
–0.5
4
V
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1000
UNIT
V
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
T_A
V_CM
V_IN
Vdiff
Supply voltage
HD3SS460
Operating free air temperature
HD3SS460I
High speed port common mode voltage
Low Speed signal voltage
High speed port differential voltage
MIN
NOM
MAX UNIT
2.7
3.3
3.6 V
0
25
70
°C
–40
25
85
0
2
V
0
VCC
0
1.8 Vpp
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
HD3SS460
QFN (RNH)
QFN (RHR)
UNIT
30 PINS
28 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
51.6
44.0
°C/W
37.5
34.8
°C/W
17.5
14.7
°C/W
0.7
0.7
°C/W
17.3
24.5
°C/W
6.8
6.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6
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