HD3SS460_17 Datasheet, PDF (28/37 Pages) Texas Instruments – 4 x 6 Channels USB Type-C Alternate Mode MUX

PACKAGE OPTION ADDENDUM
www.ti.com
13-Jan-2017
PACKAGING INFORMATION
Orderable Device
HD3SS460IRHRR
HD3SS460IRHRT
HD3SS460IRNHR
HD3SS460IRNHT
HD3SS460RHRR
HD3SS460RHRT
HD3SS460RNHR
HD3SS460RNHT
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
ACTIVE
WQFN
RHR 28 3000 Green (RoHS
& no Sb/Br)
ACTIVE
WQFN
RHR 28
250 Green (RoHS
& no Sb/Br)
PREVIEW WQFN
RNH 30 3000
TBD
PREVIEW WQFN
RNH 30 250
TBD
ACTIVE
WQFN
RHR 28 3000 Green (RoHS
& no Sb/Br)
ACTIVE
WQFN
RHR 28
250 Green (RoHS
& no Sb/Br)
PREVIEW WQFN
RNH 30 3000
TBD
PREVIEW WQFN
RNH 30 250
TBD
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
Call TI
Call TI
CU NIPDAU
CU NIPDAU
Call TI
Call TI
MSL Peak Temp Op Temp (°C)
(3)
Level-2-260C-1 YEAR -40 to 85
Level-2-260C-1 YEAR -40 to 85
Call TI
Call TI
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
0 to 70
Level-2-260C-1 YEAR 0 to 70
Call TI
Call TI
0 to 70
0 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
3SS460I
3SS460I
3SS460
3SS460
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
Samples
Addendum-Page 1