HD3SS460_17 Datasheet, PDF (33/37 Pages) Texas Instruments – 4 x 6 Channels USB Type-C Alternate Mode MUX

RNH0030A
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
30X (0.5)
1
30X (0.2)
26X (0.4)
SYMM
(1.2)
(0.7) TYP
30
26
25
(1.2)
TYP
(4.4)
(3.2)
( 0.2) TYP
VIA
FULL R
TYP
10
16
(R0.05) TYP
11
SYMM
15
(2.4)
LAND PATTERN EXAMPLE
SCALE:18X
4X (0.2)
0.05 MAX
ALL AROUND
METAL
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4221819/A 04/2015
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com