DS92LX2121_15 Datasheet, PDF (6/44 Pages) Texas Instruments – 10 - 50 MHz DC-Balanced Channel Link III Bi-Directional Control Serializer and Deserializer

DS92LX2121, DS92LX2122
SNLS330J – MAY 2010 – REVISED JANUARY 2014
www.ti.com
DS92LX2122 Deserializer PIN DESCRIPTIONS (continued)
Pin Name
Pin No.
POWER AND GROUND
VDDSSCG
3
VDDOR1/2/3
VDDD
VDDR
VDDCML
VDDPLL
VSS
29, 20, 7
17
36
40
45
DAP
I/O, Type
Description
Digital Power
Digital Power
Digital Power
Analog Power
Analog Power
Analog Power
Ground, DAP
SSCG Power, 1.8V ±5%
Power supply must be connect regardless if SSCG function is in operation
TTL Output Buffer Power, The single-ended outputs and control input are
powered from V_DDIO. V_DDIO can be connected to a 1.8V ±5% or 3.3V ±10%
Digital Core Power, 1.8V ±5%
Rx Analog Power, 1.8V ±5%
Bi-directional Channel Driver Power, 1.8V ±5%
PLL Power, 1.8V ±5%
DAP must be grounded. Connect to the ground plane (GND) with at least 16
vias.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
Supply Voltage ( V_DD1V8)
Supply Voltage (V_DD3V3)
LVCMOS Input Voltage (V_DD1V8)
LVCMOS Input Voltage (V_DD3V3)
LVCMOS Output Voltage (V_DD)
CML Receiver Input Voltage (V_DD1V8)
CML Driver Output Voltage (V_DD1V8)
Junction Temperature
−0.3V to +2.5V
−0.3V to +4.0V
−0.3V to +(V_DD1V8 + 0.3V)
−0.3V to +(V_DD3V3 + 0.3V)
−0.3V to +(V_DD + 0.3V)
−0.3V to (V_DD1V8 + 0.3V)
−0.3V to (V_DD1V8 + 0.3V)
+150°C
Storage Temperature
−65°C to +150°C
Maximum Package Power Dissipation Capacity
Package Derating:
DS92LX2121 40L WQFN
1/θ_JA °C/W above +25°
θ_JA(based on 16 thermal vias)
θ_JC(based on 16 thermal vias)
DS92LX2122 48L WQFN
30.7 °C/W
6.8 °C/W
θ_JA(based on 16 thermal vias)
θ_JC(based on 16 thermal vias)
ESD Rating (IEC61000–4–2)
Air Discharge (DOUT+, DOUT-, RIN+, RIN-)
26.9 °C/W
4.4 °C/W
R_D = 330Ω, C_S = 150 pF
≥±25 kV
Contact Discharge (DOUT+, DOUT-, RIN+, RIN-)
≥±10 kV
ESD Rating (HBM)
≥±8 kV
For soldering specifications, see the Absolute Maximum Ratings for Soldering Application Report (literature number SNOA549).
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional; the device should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
V_DD (1.8V)
V_DDIO (1.8V Mode)
V_DDIO (3.3V Mode)
1.71
1.71
3
Nom
Max
1.8
1.89
1.8
1.89
3.3
3.6
Units
V
V
V
6
Submit Documentation Feedback
Copyright © 2010–2014, Texas Instruments Incorporated
Product Folder Links: DS92LX2121 DS92LX2122