BQ2961_17 Datasheet, PDF (6/33 Pages) Texas Instruments – Overvoltage Protection for 2-Series, 3-Series, and 4-Series Cell Li-Ion Batteries with Regulated Output Supply

bq2961, bq2962
SLUSBU5D – NOVEMBER 2013 – REVISED JANUARY 2017
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7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Input voltage
Output voltage
Continuous total power dissipation, P_TOT
Lead temperature (soldering, 10 s), T_SOLDER
Storage temperature,T_stg
VDD – VSS
V4 – V3, V3 – V2, V2 – V1, V1 – VSS
REG – VSS
REG_EN – VSS
OUT – VSS
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
See Thermal
Information.
300
–65
MAX
30
30
3.6
28
30
300
150
UNIT
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Procedures. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
2000
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted).
Supply voltage,
V_DD ⁽¹⁾
Input voltage
range
Supply voltage, V_DD ⁽¹⁾, bq2960
Supply voltage, V_DD ⁽¹⁾, bq2961, bq2962
Supply voltage, V_DD with REG output on
V_n - V_n-1 , V1 – VSS
REG_EN
Operating ambient temperature range, T_A
(1) See Typical Application.
MIN
NOM
MAX UNIT
3
15
3
20 V
4
0
5V
0
15 V
–40
110 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq2960xy
DSG (WSON)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
62
°C/W
72
°C/W
32.5
°C/W
1.6
°C/W
33
°C/W
10
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6
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