THS4541_16 Datasheet, PDF (51/61 Pages) Texas Instruments – THS4541 Negative Rail Input, Rail-to-Rail Output, Precision, 850-MHz Fully Differential Amplifier

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13 Device and Documentation Support
THS4541
SLOS375A – AUGUST 2014 – REVISED SEPTEMBER 2014
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.1.2 Development Support
13.1.2.1 TINA Simulation Model Features
The device model is available as part of the TINA model library. The model includes numerous features intended
to speed designer progress over a wide range of application requirements. The following list shows the
performance parameters included in the model:
• For the small-signal response shape with any external circuit:
– Differential open loop gain and phase
– Parasitic input capacitance
– Open-loop differential output impedance
• For noise simulations:
– Input differential spot voltage noise and a 100-kHz 1/f corner
– Input current noise on each input with a 1-MHz 1/f corner
• For time-domain, step-response simulations:
– Differential slew rate
– I/O headroom models to predict clipping
– Fine-scale, dc precision terms:
– PSRR
– CMRR
The typical characterization curves show more detail than the macromodels can provide; some of those
unmodeled features include:
• Harmonic distortion
• Temperature drift in dc error terms (V_IO and I_OS)
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014, Texas Instruments Incorporated
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