THS4541_16 Datasheet, PDF (4/61 Pages) Texas Instruments – THS4541 Negative Rail Input, Rail-to-Rail Output, Precision, 850-MHz Fully Differential Amplifier

THS4541
SLOS375A – AUGUST 2014 – REVISED SEPTEMBER 2014
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
MIN
MAX
UNIT
Supply voltage, Vs+ – Vs–
5.5
V
Voltage
Input/output voltage range
(Vs–) – 0.5
(Vs+) + 0.5
V
Differential input voltage
±1
V
Continuous input current
±20
mA
Current
Continuous output current
±80
mA
Continuous power dissipation
See Thermal Information table and Thermal Analysis section
Temperature
Maximum junction temperature
Operating free-air temperature range
150
°C
–40
125
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
Machine model⁽²⁾
MIN
–65
–2000
–500
–150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
MAX
150
2000
500
150
UNIT
°C
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Vs+
Single-supply voltage
T_A
Ambient temperature
MIN
NOM
MAX UNIT
2.7
5
5.4
V
–40
25
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
THS4541
RGT (VQFN) RUN (WQFN)
UNIT
16 PINS
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
52
146
69
75
25
39
°C/W
2.7
14
25
105
9.3
47
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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