THS6226A Datasheet, PDF (5/32 Pages) Texas Instruments – THS6226A Gated-Class H, Dual-Port VDSL2 Line Driver

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THS6226A
SBOS643A – APRIL 2014 – REVISED MAY 2014
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Class AB only
Supply voltage, GND to V_{S+ Class H only}
Input voltage, V_I
Output current, I_O
Continuous power dissipation
Temperature
Static dc⁽²⁾
Maximum junction, any condition, T_J(3)
Maximum junction, continuous operation, long-term reliability,
T_J ⁽⁴⁾
MIN
MAX
UNIT
16.5
V
12.8
V
15
V
±100
mA
See Thermal Information table
150
°C
130
°C
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The device incorporates a PowerPAD on the underside of the chip, which functions as a heatsink and must be connected to a thermally
dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature, which could
permanently damage the device. See the technical brief PowerPAD™ Thermally Enhanced Package (SLMA002) for more information
about using the PowerPAD thermally-enhanced package. Under high-frequency ac operation (> 10 kHz), the short-term output current
capability is much greater than the continuous dc output current rating. This short-term output current rating is roughly 8.5 times the dc
capability, or approximately ±850 mA.
(3) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(4) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability or lifetime of the device.
6.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic
discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001
Supply and ground pins with respect to
PowerPad: GND (pins 1, 12, 29), V_SAB (pins
13, 14), V_SCD (pins 27, 28)
All other pins
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
MIN
–65
–1.5
–2
–500
MAX
150
1.5
2
500
UNIT
°C
kV
V
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