TCAN330_16 Datasheet, PDF (5/40 Pages) Texas Instruments – 3.3-V CAN Transceivers with CAN FD (Flexible Data Rate)

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8 Specifications
TCAN330, TCAN332, TCAN334, TCAN337
TCAN330G, TCAN332G, TCAN334G, TCAN337G
SLLSEQ7D – DECEMBER 2015 – REVISED APRIL 2016
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
Supply Voltage range, V_CC
Voltage at any bus terminal (CANH or CANL), V_(BUS)
Logic input terminal voltage range V_{(Logic_Input)}
Logic output terminal voltage range, V_{(Logic_Output)}
Logic output current, I_O(LOGIC)
Operating junction temperature range, T_J
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
5
V
–14
14
V
–0.3
5
V
–0.3
5
V
8
mA
–40
150
°C
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to ground terminal.
8.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC
specification JESD22-C101⁽²⁾
IEC 61400-4-2 Contact Discharge
All pins except CANH and
CANL
Pins CANH and CANL
All pins
CANH and CANL terminals to
GND
VALUE
±4000
±25000
±1500
±12000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
I_OH(LOGIC)
I_OL(LOGIC)
T_A
Supply voltage
Logic terminal HIGH level output current
Logic terminal LOW level output current
Operational free-air temperature
MIN
NOM
MAX UNIT
3
3.6
V
–2
mA
2
–40
125
°C
8.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
P_D
T_SD
T_HYS
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
Average power dissipation
Thermal shutdown temperature
V_CC = 3.3 V, T_J = 27°C, R_L = 60 Ω, SHDN, S and
STB at 0 V, Input to TXD at 500 kHz, 50% duty cycle
square wave, C_L(RXD) = 15 pF
Thermal shutdown hysteresis
TCAN33x
D (SOIC)
8 PINS
114.4
58.7
55.2
11.7
54.6
N/A
65
175
5
TCAN33x
DCN (SOT-23)
8 PINS
154.4
76.6
49.2
11.9
49.2
N/A
65
175
5
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
mW
°C
°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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