OPA187_17 Datasheet, PDF (5/35 Pages) Texas Instruments – Drift, Low Power, Rail-to-Rail Output 36-V Operational Amplifiers Zero-Drift Series

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6 Specifications
OPA187, OPA2187, OPA4187
SBOS807 – DECEMBER 2016
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage
Current
Temperature
Supply, V_S = (V⁺) – (V^–)
Signal input pin⁽²⁾
Common-mode
Differential ⁽³⁾
Signal output pin⁽⁴⁾
Signal input pin⁽²⁾
Signal output pin⁽⁴⁾
Output short-circuit⁽⁵⁾
Operating, T_A
Junction, T_J
Storage, T_stg
MIN
(V^–) – 0.5
(V^–) – 0.5
–10
–55
Continuous
–55
–65
MAX
40
(V⁺) + 0.5
±0.5
(V⁺) + 0.5
10
55
Continuous
150
150
150
UNIT
V
mA
mA
Continuous
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to ±10 mA or less.
(3) Refer to the Electrical Overstress section for more information.
(4) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5 V beyond the supply rails
should be current limited to ±55 mA or less.
(5) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(V⁺) – (V^–)
T_A
Supply voltage
Specified temperature
MIN
4.5 (±2.25)
–40
NOM
MAX
36 (±18)
125
UNIT
V
°C
6.4 Thermal Information: OPAx187
THERMAL METRIC⁽¹⁾
OPAx187
8 PINS
UNIT
DGK (VSSOP)
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
159
°C/W
37
°C/W
49
°C/W
1.2
°C/W
77.1
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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