LMH6401_16 Datasheet, PDF (5/48 Pages) Texas Instruments – LMH6401 DC to 4.5 GHz, Fully-Differential, Digital Variable-Gain Amplifier

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7 Specifications
LMH6401
SBOS730A – APRIL 2015 – REVISED MAY 2015
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
V = (VS+) – (VS–)
Digital input pins
Maximum input difference voltage
Maximum input voltage
Temperature
Maximum junction, T_J
Maximum junction, continuous operation, long-term reliability
Operating free-air, T_A
Storage, T_stg
MIN
MAX
UNIT
5.5
V
–0.3
VS+
V
2.1
V
VS–
VS+
V
150
°C
125
°C
–40
85
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Minimum operating positive (VS+) supply voltage
Ambient operating air temperature, T_A
Operating junction temperature, T_J
MIN
NOM
MAX UNIT
4.0
5.0
5.25
V
2.0
V
–40
25
85
°C
–40
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH6401
RMZ (UQFN)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
78
°C/W
43
°C/W
24
°C/W
2.3
°C/W
24
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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