LM3697_15 Datasheet, PDF (5/43 Pages) Texas Instruments – High-Efficiency Three-String White LED Driver

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LM3697
SNOSCS2C – NOVEMBER 2013 – REVISED OCTOBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
V_IN to GND
V_SW, V_OVP, V_HVLED1, V_HVLED2, V_HVLED3 to GND
V_SCL, V_SDA, V_PWM to GND
V_HWEN to GND
Continuous power dissipation
Junction temperature (T_J-MAX)
Storage temperature, T_stg
MIN
MAX
−0.3
6
−0.3
45
−0.3
6
−0.3
6
Internally Limited
150
−65
150
UNIT
V
V
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_IN to GND
V_SW, V_OVP, V_HVLED1, V_VHLED2, V_HVLED3 to GND
Junction temperature (T_J)⁽¹⁾⁽²⁾
MIN
MAX
UNIT
2.7
5.5
V
0
40
V
−40
125
°C
(1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J= 140°C (typical) and
disengages at T_J= 125°C (typical).
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × PD-MAX).
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LM3697
YFQ (DSBGA)
UNIT
12 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
92.1
°C/W
0.8
°C/W
15.6
°C/W
3.3
°C/W
15.6
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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