HD3SS214_16 Datasheet, PDF (5/25 Pages) Texas Instruments – 8.1 Gbps DisplayPort 1.3 2:1/1:2 Differential Switch

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HD3SS214
SLAS907A – DECEMBER 2015 – REVISED JULY 2016
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾
over operating free-air temperature range (unless otherwise noted)
Supply voltage range⁽³⁾
Voltage range
V_DD
Differential I/O
Control pin
Continuous power dissipation
MIN
MAX
UNIT
–0.5
4
V
–0.5
4
V
–0.5
V_DD + 0.5
See Thermal Information
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Typical values for all parameters are at V_CC = 3.3 V and T_A = 25°C. All temperature limits are specified by design.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V_DD
Supply voltage
V_IH
Input high voltage
Control Pins, Signal Pins
(Dx_SEL, AUX_SEL, MODE, OE)
3
3.3
3.6
2
V_DD
V_IM
Input mid level voltage
AUX_SEL Pin
V_DD/2 -300
mV
V_DD/2
V_DD/2 -300
mV
V_IL
Input low voltage
Control Pins, Signal Pins
(Dx_SEL, AUX_SEL, MODE, OE)
-0.1
0.8
V_{I/O_Diff}
V_{I/O_CM}
Differential voltage (Dx, AUXx)
Dx switching I/O Common mode voltage
AUXx (1) switching I/O Common mode
voltage
Switch I/O diff voltage
Switch I/O common mode voltage
0
1.8
0
2
0
3.6
Operating free-air temperature
HD3SS214
HD3SS214I
0
70
–40
105
UNIT
V
V
V
V
Vpp
V
°C
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
HD3SS214
ZQE (µBGA)
UNIT
50 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
90.5
°C/W
41.9
°C/W
53.9
°C/W
1.8
°C/W
53.4
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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