CD4051B_15 Datasheet, PDF (5/38 Pages) Texas Instruments – CMOS Single 8-Channel Analog Multiplexer/Demultiplexer

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CD4051B, CD4052B, CD4053B
SCHS047H – AUGUST 1998 – REVISED APRIL 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
T_JMAX1
T_JMAX2
T_LMAX
T_stg
Supply Voltage
DC Input Voltage
V+ to V-, Voltages Referenced to V_SS Terminal
DC Input Current
Any One Input
Maximum junction temperature, ceramic package
Maximum junction temperature, plastic package
Maximum lead temperature, SOIC - Lead Tips Only, Soldering 10s
Storage temperature
MIN
MAX
UNIT
–0.5
20
V
–0.5
–10
V_DD + 0.5
V
10
mA
175
°C
150
°C
265
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
CD4051B in PDIP, CDIP, SOIC, SOP, TSSOP Packages
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
V_(ESD) Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
CD4053B in PDIP, CDIP, SOP and TSSOP Packages
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
V_(ESD) Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
+3000
+2000
+2500
+1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Temperature Range
MIN
MAX
UNIT
–55
125
°C
6.4 Thermal Information
CD405xB
THERMAL METRIC⁽¹⁾
E (PDIP) M (SOIC)
NS (SOP)
PW
(TSSOP)
UNIT
16 PINS 16 PINS 16 PINS 16 PINS
R_θJA Junction-to-ambient thermal resistance
67
73
64
108
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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