CC256X_13 Datasheet, PDF (43/51 Pages) Texas Instruments – Bluetooth and Dual-Mode Controller

CC256x
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7 Chip Packaging and Ordering
SWRS121C – JULY 2012 – REVISED OCTOBER 2013
7.1 Package and Ordering Information
The mrQFN packaging is 76 pins and a 0.6-mm pitch.
For detailed information, see Section 6, mrQFN Mechanical Data.
Table 7-1 lists the package and order information for the device family members.
Table 7-1. Package and Order Information
Device
Package Suffix
CC2560ARVMT
RVM
CC2560ARVMR
RVM
CC2564RVMT
RVM
CC2564RVMR
RVM
CC2560BRVMT
RVM
CC2560BRVMR
RVM
CC2564BRVMT
RVM
CC2564BRVMR
RVM
Figure 7-1 shows the chip markings for the CC256x family.
Pieces/Reel
250
2500
250
2500
250
2500
250
2500
Figure 7-1. Chip Markings
7.1.1 Device Support Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These
prefixes represent evolutionary stages of product development from engineering prototypes through fully
qualified production devices.
X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and
may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer:
“This product is still in development and is intended for internal evaluation purposes.” Notwithstanding any provision to the
contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of
fitness for a specific purpose, of this device.
null Device is qualified and released to production. TI’s standard warranty applies to production devices.
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Chip Packaging and Ordering
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