CC256X_13 Datasheet, PDF (41/51 Pages) Texas Instruments – Bluetooth and Dual-Mode Controller

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6 mrQFN Mechanical Data
RVM (S-PVQFN-N76)
CC256x
SWRS121C – JULY 2012 – REVISED OCTOBER 2013
PLASTIC QUAD FLATPACK NO-LEAD
8,10
7,90
SQ
7,83
7,63 ^SQ
Pin 1 Indentifier
0,90
0,80
0,08 C
0,30 TYP
4X 5,40
4X 4,80
0,65
0,55
Seating Plane
0,05
0,00
CL –
PKG.
CL –
PAD
0,60
4X _0,24
4X ^0,60
0,24
THERMAL PAD
SIZE AND SHAPE
SHOWN ON SEPARATE SHEET
4X 0,70
0,17
0,60
0,25
76X _0,15
0,10
CAB
0,50
76X _0,30
0,10
CAB
NOTES:
Bottom View
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5-1994.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No-Lead) Package configuration.
D. The package thermal pad must be soldered to the board for thermal and mechanical performance.
E. See the additional figure in the Product Data Sheet for details regarding the exposed thermal pad features and dimensions.
4211965/B 12/11
SWRS115-001
Copyright © 2012–2013, Texas Instruments Incorporated
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