CC256X Datasheet, PDF (42/51 Pages) Texas Instruments – Bluetooth® Smart Ready Controller

CC256x
SWRS121C – JULY 2012 – REVISED OCTOBER 2013
RVM (S-PVQFN-N76)
www.ti.com
PLASTIC QUAD FLATPACK NO-LEAD
THERMAL INFORMATION
This package incorporates an exposed thermal pad that is designed to be attached directly to an external
heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the
PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached
directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be
attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the
integrated circuit (IC).
For information on the Quad Flatpack No-Lead (QFN) package and its advantages, refer to Application Report,
QFN/SON PCB Attachment, Texas Instruments Literature No. SLUA271. This document is available at www.ti.com.
The exposed thermal pad dimensions for this package are shown in the following illustration.
CL-
PKG.
0,17
3,30±0,10
CL-
PAD
3,00±0,10
Bottom View
Exposed Thermal Pad Dimensions
NOTE: All linear dimensions are in millimeters
4212066/B 12/11
SWRS115-018
42
mrQFN Mechanical Data
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