TLC59108F_15 Datasheet, PDF (4/37 Pages) Texas Instruments – 8-Bit FM+ I2C Bus LED Driver

TLC59108F
SLDS162B – MARCH 2009 – REVISED DECEMBER 2015
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC
Supply voltage
V_I
Input voltage
V_O
Output voltage
I_O
Continuous output current
P_D
Power dissipation, T_A = 25 °C, JESD 51-7
T_J
Junction temperature
T_stg
Storage temperature
PW package
RGY package
MIN
MAX
UNIT
0
7
V
–0.4
7
V
–0.5
20
V
120
mA
1.2
W
2.2
–40
150
°C
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±1500
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
See ⁽¹⁾.
V_CC Supply voltage
V_IH High-level input voltage
V_IL
Low-level input voltage
V_O
Output voltage
I_OL
Low-level output current
I_O
Output current
T_A
Operating free-air temperature
SCL, SDA, RESET, A0, A1, A2, A3
SCL, SDA, RESET, A0, A1, A2, A3
OUT0 to OUT7
SDA
OUT0 to OUT7
V_CC = 3 V
V_CC = 4.5 V
(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation.
MIN
3
0.7 × V_CC
0
5
–40
MAX
5.5
5.5
0.3 × V_CC
17
20
30
120
85
UNIT
V
V
V
V
mA
mA
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLC59108F
PW (TSSOP) RGY (VQFN)
UNIT
20 PINS
20 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
98.9
39.1
°C/W
32.9
44.7
°C/W
49.9
14.8
°C/W
1.7
1.0
°C/W
49.3
14.9
°C/W
—
7.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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