TCA9546A Datasheet, PDF (4/31 Pages) Texas Instruments – Low Voltage 4-Channel I2C and SMBus Switch with Reset Function

TCA9546A
SCPS205A – APRIL 2014 – REVISED FEBRUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage range
V_I
Input voltage range⁽²⁾
I_I
Input current
I_O
Output current
Continuous current through V_CC
Continuous current through GND
P_tot
Total power dissipation
T_A
Operating free-air temperature range
T_stg
Storage temperature range
MIN MAX UNIT
–0.5
7V
–0.5
7V
±20 mA
±25 mA
±100 mA
±100 mA
400 mW
–40
85 °C
-65
150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1500
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
7.3 Recommended Operating Conditions⁽¹⁾
MIN
MAX UNIT
V_CC
Supply voltage
V_IH
High-level input voltage
V_IL
Low-level input voltage
T_A
Operating free-air temperature
SCL, SDA
A2–A0, RESET
SCL, SDA
A2–A0, RESET
1.65
5.5 V
0.7 × V_CC
6
V
0.7 × V_CC V_CC + 0.5
–0.5 0.3 × V_CC
V
–0.5 0.3 × V_CC
–40
85 °C
(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
TCA9546A
D
PW
16 PINS
16 PINS
92.3
122.3
52.3
56.6
50.1
57.4
17.7
10.9
49.8
66.8
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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