OPA2670IRGVR Datasheet, PDF (4/25 Pages) Texas Instruments – Single Port, High Output Current VDSL2 Line Driver with Power Control

OPA2670
SBOS434 – AUGUST 2010
www.ti.com
ELECTRICAL CHARACTERISTICS: V_S = +12V (continued)
Boldface limits are tested at +25°C. At T_A = +25°C, A₀ = A₁ = 0 (full power), G = +5V/V, R_F = 432Ω, and R_L = 100Ω, and fully
differential specifications, unless otherwise noted. See Figure 38 for ac performance only.
PARAMETER
CONDITIONS
OPA2670IRGV
MIN
TYP
MAX
UNITS
TEST
LEVEL ⁽¹⁾
OUTPUT
Voltage output swing
No load, each amplifier
±5
V
C
50Ω differential load, each amplifier
±4.7
±4.8
V
B
20Ω differential load, each amplifier
±4.55
±4.7
V
A
Output current at full bias (peak)
Output current at mid bias (peak)
Output current at low bias (peak)
Short-circuit current
Closed-loop output impedance at full bias
V_O = 0V, A₁ = 0, A₀ = 0, each amplifier
V_O = 0V, A₁ = 0, A₀ = 1, each amplifier
V_O = 0V, A₁ = 1, A₀ = 0, each amplifier
V_O = 0V, each amplifier
G = +4V/V, f ≤ 100kHz, A₁ = 0, A₀ = 0,
each amplifier
±500
±500
±450
±700
±600
±500
1.2
0.01
mA
A
mA
A
mA
A
A
C
Ω
C
Closed-loop output impedance at mid bias
G = +4V/V, f ≤ 1MHz, A₁ = 0, A₀ = 1,
each amplifier
0.01
Ω
C
Closed-loop output impedance at low bias
G = +4V/V, f ≤ 1MHz, A₁ = 1, A₀ = 0,
each amplifier
0.02
Ω
C
Output impedance at shutdown
each amplifier
25 || 4
kΩ || pF
C
Output switching glitch
Inputs at GND, each amplifier
±20
mV
C
POWER SUPPLY
Specified operating voltage
+5.5
+12
+12.6
V
A
–40°C to +85°C
+12.6
V
B
Quiescent current at full bias
V_S = +12V, A₁ = 0, A₀ = 0
–40°C to +85°C
29.5
30.5
31.5
mA
A
28.5
32.5
mA
B
Supply current at mid bias
V_S = +12V, A₁ = 0, A₀ = 1
–40°C to +85°C
20
22
24
mA
A
19
25
mA
B
Supply current at low bias
V_S = +12V, A₁ = 1, A₀ = 0
–40°C to +85°C
13
14
16
mA
A
12
17
mA
B
Supply current (disabled)
V_S = +12V, A₁ = 1, A₀ = 1
–40°C to +85°C
0.9
1
mA
A
1.2
mA
B
Supply current step time
Time to reach 90% final value
250
ns
C
Power-supply rejection ratio
(+PSRR)
Input-referred
48
54
dB
A
THERMAL CHARACTERISTICS
Specified operating temperature range
R_GV package
–40 to
+85
°C
C
Thermal resistance, q _JA
RGV
QFN-16
Junction-to-ambient
PowerPAD soldered to PCB
51.2
°C/W
C
PowerPAD floating⁽³⁾
75
°C/W
C
(3) PowerPAD is physically connected to the negative supply (–V_S) for dual-supply configuration or the ground (GND) for single-supply
configuration.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
q_JA
q_JCtop
q_JB
y_JT
y_JB
q_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
OPA2670
RGV
16 PINS
51.2
56.7
54.3
3.5
35.6
2.5
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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