OPA2670IRGVR Datasheet, PDF (19/25 Pages) Texas Instruments – Single Port, High Output Current VDSL2 Line Driver with Power Control

OPA2670
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e) Socketing a high-speed part such as the
OPA2670 is not recommended. The additional lead
length and pin-to-pin capacitance introduced by the
socket can create an extremely troublesome parasitic
network, which can make it almost impossible to
achieve a smooth, stable frequency response. Best
results are obtained by soldering the OPA2670
directly onto the board.
SBOS434 – AUGUST 2010
f) Use the –V_S plane to conduct heat out of the
QFN-16 PowerPAD package. This package attaches
the die directly to an exposed thermal pad on the
bottom, which should be soldered to the board. This
pad must be connected electrically to the same
voltage plane as the most negative supply applied to
the OPA2670 (in Figure 39, this supply is GND).
Copyright © 2010, Texas Instruments Incorporated
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