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LMH6552 Datasheet, PDF (4/38 Pages) Texas Instruments – 1.5-GHz Fully Differential Amplifier
LMH6552
SNOSAX9I – APRIL 2007 – REVISED JANUARY 2015
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7 Specifications
7.1 Absolute Maximum Ratings(1)(2)
MIN
MAX
UNIT
Supply Voltage
13.2
V
Common Mode Input Voltage
Maximum Input Current (pins 1, 2, 7, 8)
Maximum Output Current (pins 4, 5)
±VS
V
30
mA
(3)
mA
Maximum Junction Temperature
150
°C
Storage temperature, Tstg
−65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering specifications see SNOA549
(3) The maximum output current (IOUT) is determined by device power dissipation limitations. See Power Dissipation for more details.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
Machine model (MM)
VALUE
±2000
±750
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
Operating Temperature Range (1)
Total Supply Voltage
MIN NOM MAX UNIT
−40
+85 °C
4.5
12 V
(1) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX)– TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.
7.4 Thermal Information
THERMAL METRIC(1)
LMH6552
D
NGS
UNIT
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
150
58
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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