LMC6484 Datasheet, PDF (4/45 Pages) National Semiconductor (TI) – CMOS Quad Rail-to-Rail Input and Output Operational Amplifier

LMC6484
SNOS675C – AUGUST 2000 – REVISED SEPTEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
See ^{(1) (2)}
Differential input voltage
Voltage at input/output pin
Supply voltage (V⁺ − V^−)
Current at input pin⁽³⁾
Current at output pin⁽⁴⁾⁽⁵⁾
Current at power supply pin
Junction temperature⁽⁶⁾
Storage temperature, T_stg
MIN
MAX
±Supply Voltage
(V^−) − 0.3
(V⁺) + 0.3
16
±5
±30
40
150
−65
150
UNIT
V
V
mA
mA
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(4) Applies to both single supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(5) Do not short circuit output to V⁺, when V⁺ is greater than 13 V or reliability will be adversely affected.
(6) The maximum power dissipation is a function of T_J(max), R_θJA, and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(max) − T_A)/R_JθA. All numbers apply for packages soldered directly into a PC board.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾
VALUE
±2000
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) Human body model, 1.5-kΩ resistor in series with 100 pF. All pins rated per method 3015.6 of MIL-STD-883. This is a class 2 device
rating.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage, V+
Junction temperature, T_J
LMC6484AM
LMC6484AI, LMC6484I
MIN
MAX UNIT
3
15.5
V
−55
125
°C
−40
85
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMC6484
D (SOIC)
NFF (PDIP)
UNIT
14 PINS
14 PINS
R_θJA
Junction-to-ambient thermal resistance
110
70
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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