LM3537_13 Datasheet, PDF (4/33 Pages) Texas Instruments – 8-Channel WLED Driver with Four Integrated LDOs

LM3537
SNVS634B – JUNE 2011 – REVISED MAY 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS^(1)(2)(3)
V_{IN_A}, V_{IN_B} , V_{IN_C} pin voltage
Voltage on Logic Pins (SCL, SDA, GPO1, GPO2, HWEN, PWM)
LED driver (D1 to D8) Pin Voltages
Voltage on All Other Pins
Continuous Power Dissipation⁽⁴⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
ESD Rating⁽⁵⁾ Human Body Model
-0.3V to 6.0V
-0.3V to (V_{IN_A}+0.3V) with 6.0V max
-0.3V to (V_OUT+0.3V) with 6.0V max
-0.3V to (V_{IN_A} +0.3V) with 6.0V max
Internally Limited
150°C
-40°C to +150°C
2 kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and
disengages at T_J = 155°C (typ.).
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7)
OPERATING RATINGS⁽¹⁾⁽²⁾
V_{IN_A}, V_{IN_B} Input Voltage Range
LED Voltage Range
2.7V to 5.5V
2.0V to 4.0V
V_{IN_C} Input Voltage Range (Note: must stay > V_OUTLDO + 0.3V)
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range⁽³⁾
1.8V to V_{IN_B}
−30°C to +110°C
−30°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
110°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
THERMAL PROPERTIES⁽¹⁾
Junction-to-Ambient Thermal Resistance (θ_JA), YFQ Package⁽²⁾
45°C/W
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(2) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to Texas
Instruments' Application Note AN-1112: DSBGA Wafer Level Chip Scale Package (Literature Number SNVA009).
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