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HD3SS3411-Q1 Datasheet, PDF (4/23 Pages) Texas Instruments – One Channel Differential 2:1 Mux/Demux
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HD3SS3411-Q1
SLASE82A – JUNE 2015 – REVISED JULY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings(1)
Over operating free-air temperature range (unless otherwise noted)
Supply voltage range (VCC)
Voltage range
Absolute minimum/maximum supply voltage range
Differential I/O
Control pin
MIN
MAX
UNIT
–0.5
4
V
–0.5
–0.5
2.5
V
VDD + 0.5
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per AEC Q100-002(1)
Charged-device model (CDM), per AEC Q100-011
VALUE
±2000
±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
VIH
Input high voltage (SEL, OEn Pin)
VIL
Input low voltage (SEL OEn Pin)
VDiff
High speed signal pins differential voltage
VCM
Common mode voltage (differential pins)
TA
Operating free-air temperature
MIN
3
2
–0.1
0
0
–40
NOM
MAX
3.6
VCC
0.8
1.8
2
105
UNIT
V
V
V
VPP
V
°C
7.4 Thermal Information
THERMAL METRIC(1)
RWA
14 PINS
UNIT
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
50.5
63.1
26.4
°C/W
2.2
26.5
7.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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