HD3SS3411-Q1 Datasheet, PDF (17/23 Pages) Texas Instruments – One Channel Differential 2:1 Mux/Demux

RWA0014A
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
14X (0.6)
( 2.05)
2X (1.5)
1
SYMM
14
2
13
14X (0.25)
SYMM
8X (0.5)
6
( 0.2) VIA
TYP
(R0.05) TYP
(3.3)
D_(0.78)
SE⁹
EA ₇
8
L(0.78)
(3.3)
RE ^{LAND PATTERN EXAMPLE}
T _{0.07 MAX}
NO ^{ALL AROUND}
METAL
SCALE:20X
0.07 MIN
ALL SIDES
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4221612/B 01/2015
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com