DRV8832-Q1 Datasheet, PDF (4/20 Pages) Texas Instruments – Low-Voltage Motor Driver IC

DRV8832-Q1
SLVSBW9C – APRIL 2013 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
VCC Power supply voltage
Input pin voltage
Peak motor drive output current⁽³⁾
Continuous motor drive output current⁽³⁾
Continuous total power dissipation
T_J Operating virtual junction temperature
T_stg Storage temperature
MIN
MAX
–0.3
7
–0.5
7
Internally limited
–1
1
See Themral Information
–40
150
–60
150
UNIT
V
V
A
A
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±4000
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
Motor power supply voltage
I_OUT
Continuous or peak H-bridge output current⁽¹⁾
(1) Power dissipation and thermal limits must be observed.
MIN
NOM
MAX UNIT
2.75
6.8
V
0
1
A
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV8832-Q1
DGQ (MSOP)
UNIT
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
69.3
°C/W
63.5
°C/W
51.6
°C/W
1.5
°C/W
23.2
°C/W
9.5
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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