DRV425 Datasheet, PDF (4/37 Pages) Texas Instruments – DRV425 Fluxgate Magnetic-Field Sensor

DRV425
SBOS729 – OCTOBER 2015
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage
Current
Temperature
Supply voltage (VDD to GND)
Input voltage, except AINP and AINN pins⁽²⁾
Shunt-sense amplifier inputs (AINP and AINN pins)⁽³⁾
DRV1 and DRV2 pins (short-circuit current, I_OS)⁽⁴⁾
Shunt-sense amplifier input pins AINP and AINN
All remaining pins
Junction, T_J max
Storage, T_stg
MIN
–0.3
GND – 0.5
GND – 6.0
–300
–5
–25
–50
–65
MAX
6.5
VDD + 0.5
VDD + 6.0
300
5
25
150
150
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be
current limited, except for the differential amplifier input pins.
(3) These inputs are not diode-clamped to the power-supply rails.
(4) Power-limited; observe maximum junction temperature.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VDD
T_A
Supply voltage range (VDD to GND)
Specified ambient temperature range
MIN
NOM
MAX UNIT
3.0
5.0
5.5
V
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV425
RTJ (WQFN)
UNIT
20 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
34.1
°C/W
33.1
°C/W
11
°C/W
0.3
°C/W
11
°C/W
2.1
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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