DRV2605L-Q1 Datasheet, PDF (4/67 Pages) Texas Instruments – Automotive Haptic Driver for LRA and ERM

DRV2605L-Q1
SLOS874A – OCTOBER 2015 – REVISED OCTOBER 2015
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range, T_A = 25°C (unless otherwise noted)
MIN
V_DD
–0.3
EN
–0.3
Input voltage
SDA
–0.3
SCL
–0.3
IN/TRIG
–0.3
Operating free-air temperature, T_A
–40
Operating junction temperature, T_J
–40
Storage temperature, T_stg
–65
MAX
5.5
V_DD + 0.3
V_DD + 0.3
V_DD + 0.3
V_DD + 0.3
105
150
150
UNIT
V
V
V
V
V
°C
°C
°C
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per AEC Q100-011
VALUE
±500
±1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_DD
ƒ_(PWM)
Z_L
V_IL
V_IH
V_I(ANA)
ƒ_(LRA)
Supply voltage
PWM input frequency⁽¹⁾
Load impedance⁽¹⁾
Digital low-level input voltage
Digital high-level input voltage
Input voltage (analog mode)
LRA Frequency Range⁽¹⁾
V_DD
IN/TRIG Pin
V_DD = 5.2 V
EN, IN/TRIG, SDA, SCL
EN, IN/TRIG, SDA, SCL
IN/TRIG
(1) Ensured by design. Not production tested.
MIN
MAX UNIT
2
5.2 V
10
250 kHz
8
Ω
0.5 V
1.3
V
0
1.8 V
125
300 Hz
6.4 Thermal Information
THERMAL METRIC
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
DRV2605L-Q1
DGS (VSSOP)
(10-PINS)
161.5
38.8
82
1.3
80.5
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
4
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