DRV120_15 Datasheet, PDF (4/23 Pages) Texas Instruments – Power-Saving Current Controlled Solenoid Driver

DRV120
SLVSBG3B – JUNE 2012 – REVISED JULY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾
VIN Input voltage
Voltage on EN, STATUS, PEAK, HOLD, OSC, SENSE, RAMP
Voltage on OUT
T_J Operating virtual junction temperature
T_stg Storage temperature
MIN
MAX
UNIT
–0.3
28
V
–0.3
7
V
–0.3
28
V
–40
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
I_OUT
Average solenoid DC current
V_IN
Supply voltage
C_IN
Input capacitor
L
Solenoid inductance
T_A
Operating ambient temperature
MIN
NOM
MAX UNIT
125
mA
6
12
26
V
1
4.7
µF
1
H
–40
105
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV120
PW [TSSOP]
UNIT
8 PINS
14 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
183.8
69.2
112.6
10.4
110.9
N/A
122.6
51.2
64.3
6.5
63.7
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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