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DAC8812 Datasheet, PDF (4/29 Pages) Texas Instruments – Dual, Serial Input 16-Bit Multiplying Digital-to-Analog Converter | |||
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DAC8812
SBAS349D â AUGUST 2005 â REVISED JANUARY 2016
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
VDD to GND
VREFx, RFBx to GND
Digital logic inputs to GND
â0.3
â18
â0.3
IOUTx to GND
AGNDx to DGND
Input current to any pin except supplies
â0.3
â0.3
â50
Package power dissipation
Maximum junction temperature (TJmax)
Operating temperature
â40
Storage temperature, Tstg
â65
MAX
7
18
VDD + 0.3
VDD + 0.3
0.3
50
(150°C â TA) /
RθJA
150
85
150
UNIT
V
V
V
V
V
mA
W
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±4000
±1000
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±4000
V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±1000
V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
VDD
Supply voltage to GND
TA
Operating ambient temperature
MIN
NOM
MAX UNIT
2.7
5.5
V
â40
125
°C
7.4 Thermal Information
THERMAL METRIC(1)
DAC8812
PW (TSSOP)
UNIT
16 PINS
RθJA
RθJC(top)
RθJB
ÏJT
ÏJB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
100.6
32.8
46.8
2
46
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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