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BQ32002 Datasheet, PDF (4/29 Pages) Texas Instruments – BQ32002 Real-Time Clock (RTC)
BQ32002
SLUSA96B – AUGUST 2010 – REVISED APRIL 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VIN Input voltage
TJ Operating junction temperature
Tstg Storage temperature after reflow
VCC to GND
All other pins to GND
MIN
MAX
UNIT
–0.3
4
V
–0.3
VCC + 0.3
–40
150
°C
–60
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
2000
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
VCC Supply voltage, VCC to GND
TA
Operating free-air temperature
fo
Crystal resonant frequency
RS
Crystal series resistance
CL
Crystal load capacitance(1)
(1) Crystal load capacitance ±10% is allowed.
MIN NOM
3
–40
32.768
12
MAX
3.6
85
70
UNIT
V
°C
kHz
kΩ
pF
6.4 Thermal Information
RθJA
RθJC(top)
RθJB
ψJT
ψJB
THERMAL METRIC(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
BQ32002
D (SOIC)
8 PINS
114.8
59.1
55.5
11.9
55
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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