BQ27621-G1_16 Datasheet, PDF (4/26 Pages) Texas Instruments – System-Side Fuel Gauge With Dynamic Voltage Correlation

bq27621-G1
SLUSBB3E – DECEMBER 2013 – REVISED JANUARY 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
PARAMETER
V_BAT
V_DD
V_IOD
V_IOPP
T_A
T_stg
BAT pin input voltage range
V_DD pin supply voltage range (LDO output)
Open-drain I/O pins (SDA, SCL, GPOUT)
Push-Pull I/O pins (BIN)
Operating free-air temperature range
Storage temperature
MIN
MAX UNIT
–0.3
6V
–0.3
2V
–0.3
6V
–0.3
–40
[V_DD + 0.3]
V
85 °C
–65
150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±1000
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
T_A = 30°C and V_REGIN = V_BAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
C_BAT ⁽¹⁾
C_LDO18 ⁽¹⁾
V_PU ⁽¹⁾
Optional external input capacitor for
internal LDO between BAT and V_SS
External output capacitor for internal
LDO between V_DD and V_SS
External pullup voltage for open-drain
pins (SDA, SCL, GPOUT)
Nominal capacitor values specified.
Recommend a 5% ceramic X5R type
capacitor located close to the device.
(1) Specified by design. Not production tested.
MIN
NOM
0.1
0.47
1.62
MAX
UNIT
μF
μF
3.6
V
7.4 Thermal Information
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
bq27621-G1
YZF (DSBGA)
9 PINS
107.8
0.7
60.4
3.5
60.4
n/a
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics Application Report, SPRA953.
7.5 Supply Current
T_A = 30°C and V_REGIN = V_BAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I_CC ⁽¹⁾
I_SLP ⁽¹⁾
NORMAL mode current
SLEEP mode current
I_LOAD > Sleep Current
I_LOAD < Sleep Current
MIN
TYP
27
21
MAX
UNIT
μA
μA
(1) Specified by design. Not production tested.
4
Submit Documentation Feedback
Product Folder Links: bq27621-G1
Copyright © 2013–2016, Texas Instruments Incorporated