BQ25071-Q1 Datasheet, PDF (4/22 Pages) Texas Instruments – Automotive Qualified

bq25071-Q1
SLUSCD6 – APRIL 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings ⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Input Voltage
Output Voltage
Input Current (Continuous)
Output Current (Continuous)
Output Current (Continuous)
Output Sink Current
Junction temperature, T_J
Storage temperature, T_STG
IN (with respect to GND)
EN, TS (with respect to GND)
BAT, OUT, LDO, CHG, ISET (with respect to GND)
IN
BAT
LDO
CHG
MIN
MAX
UNIT
–0.3
30
V
–0.3
7
V
–0.3
7
V
1.2
A
1.2
A
100
mA
5
mA
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground pin unless otherwise noted.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per aec q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±3000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
V_IN IN operating voltage
I_IN Input current, IN
I_OUT Output Current in charge mode, OUT
T_J Junction Temperature
(1) Charge current may be limited at low input voltages due to the dropout of the device.
MIN
3.75
(1)
MAX UNITS
8V
1A
1A
-40
125 °C
7.4 Thermal Information
THERMAL METRIC ⁽¹⁾
bq25071-Q1
DQC (WSON)
UNIT
10 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
61.6
65.5
22.8
°C/W
1.5
22.7
5.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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