BQ25071-Q1 Datasheet, PDF (16/22 Pages) Texas Instruments – Automotive Qualified

bq25071-Q1
SLUSCD6 – APRIL 2016
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9.2.2 Detailed Design Procedure
9.2.2.1 Selection of Input and Output Capacitors
In most applications, all that is needed is a high-frequency decoupling capacitor on the input power pin. For
normal charging applications, a 0.1 μF ceramic capacitor, placed in close proximity to the IN pin and GND pad
works best. In some applications, depending on the power supply characteristics and cable length, it may be
necessary to increase the input filter capacitor to avoid exceeding the OVP voltage threshold during adapter hot
plug events where the ringing exceeds the deglitch time.
The charger in the bq25071-Q1 requires a capacitor from OUT to GND for loop stability. Connect a 1 μF ceramic
capacitor from OUT to GND close to the pins for best results. More output capacitance may be required to
minimize the output drop during large load transients.
The LDO also requires an output capacitor for loop stability. Connect a 0.1 μF ceramic capacitor from LDO to
GND close to the pins. For improved transient response, this capacitor may be increased.
9.2.2.2 Thermal Considerations
The bq25071-Q1 is packaged in a thermally enhanced QFN package. The package includes a thermal pad to
provide an effective thermal contact between the IC and the printed circuit board (PCB). Full PCB design
guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment Application
Note (SLUA271).
The most common measure of package thermal performance is thermal impedance (θ_JA) measured (or modeled)
from the chip junction to the air surrounding the package surface (ambient). The mathematical expression for θ_JA
is:
Where:
q _JA
=
T_J
- T_A
P_D
(5)
T_J = chip junction temperature
T_A = ambient temperature
P_D = device power dissipation
Factors that can greatly influence the measurement and calculation of θ_JA include:
• Whether or not the device is board mounted
• Trace size, composition, thickness, and geometry
• Orientation of the device (horizontal or vertical)
• Volume of the ambient air surrounding the device under test and airflow
• Whether other surfaces are in close proximity to the device being tested
The device power dissipation, P_D, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from the following equation when a battery pack is being charged:
P_D = (V_IN – V_OUT) × I_OUT
Due to the charge profile of LiFePO₄ batteries the maximum power dissipation is typically seen at the beginning
of the charge cycle when the battery voltage is at its lowest. See the charging profile, Figure 10. If the board
thermal design is not adequate the programmed fast charge rate current may not be achieved under maximum
input voltage and minimum battery voltage, as the thermal loop can be active, effectively reducing the charge
current to avoid excessive IC junction temperature.
16
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